IT之家 9 月 5 日消息，集邦咨询 Trendforce 今天（9 月 5 日）发布博文，伴随着参与者越来越多，倒装芯片球栅阵列封装（FCBGA）基板行业正在蓬勃发展。

According to the Yole Group, the advanced IC substrate market is expected to have a CAGR of 9% up to 2029 reaching a ...

兴森科技：公司FCBGA封装基板送样认证进度正常推进中 每经AI快讯，有投资者在投资者互动平台提问：六月份公司送样给大客户的ABF载板（广州基地 ...

The advanced IC substrate market is expected to have a CAGR 24-29 of 9% to  $25.53 billion in 2029, according to Yole Group.

Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...

Samsung Electro-Mechanics pledged to ramp up the portion of sales of its premium chip package substrate known as Flip Chip ...

Electronics Engineering Herald is an online magazine for electronic engineers with focus on hardware design, embedded, VLSI, and design tools. EE Herald publishes design ideas, technology trends, ...

FCBGA is a semiconductor package substrate applied to high-performance semiconductors, such as central processing units and graphic processing units for servers and PCs. It can be used in various ...

一种集成式 IC 封装解决方案，涵盖了各种集成技术（如 FCBGA、FOWLP、2.5/3D IC 等 ... 设计人员需要一种 EDA 平台，例如 Xpedition Substrate Integrator (xSI)，它能聚合多基底系统的不同格式并生成一个可驱动装配验证的系统级网表。使用 Xpedition Substrate Integrator 和 Calibre ...