Abstract: The investigation of the manipulation of the physical structure of an electrolytic cell to achieve uniform solder bumps on a silicon wafer is discussed. The variables investigated include: ...

Abstract: The choice of solder joint metallurgy is a key issue especially for the reliability of flip-chip assemblies. Besides the metallurgical systems already widely used and well understood, new ...

Also called a "solder bump." See BGA. THIS DEFINITION IS FOR PERSONAL USE ONLY. All other reproduction requires permission.

Covering the cost, design, materials, process, equipment, manufacturing, and reliability issues, this comprehensive guide provides cutting edge information on lead-free, halogen-free, and ...

Advanced IC packaging is transforming the semiconductor industry, driving performance and efficiency amid the global chip ...

The blob of solder method leaves a little more solder on the part than is optimal, sometimes a bulbous lump of the stuff. Instead, he puts a bit of flux on the pad and then applies a much smaller ...

Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...

Covering the cost, design, materials, process, equipment, manufacturing, and reliability issues, this comprehensive guide provides cutting edge information on lead-free, halogen-free, and ...

Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip version ; UMC 40nm LP LowK Logic Process View Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder ...

Data Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip version ; UMC 40nm LP LowK Logic Process View Data Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip ...

Ryobi introduced its USB Lithium platform to offer a lower-powered, but more affordable alternative to its already ...