FCBGA is a semiconductor package substrate applied to high-performance semiconductors, such as central processing units and graphic processing units for servers and PCs. It can be used in various ...

According to the Yole Group, the advanced IC substrate market is expected to have a CAGR of 9% up to 2029 reaching a ...

The advanced IC substrate market is expected to have a CAGR 24-29 of 9% to  $25.53 billion in 2029, according to Yole Group.

Electronics Engineering Herald is an online magazine for electronic engineers with focus on hardware design, embedded, VLSI, and design tools. EE Herald publishes design ideas, technology trends, ...

Samsung Electro-Mechanics pledged to ramp up the portion of sales of its premium chip package substrate known as Flip Chip ...

Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...