Abstract: The choice of solder joint metallurgy is a key issue especially for the reliability of flip-chip assemblies. Besides the metallurgical systems already widely used and well understood, new ...

Data Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip version ; UMC 40nm LP LowK Logic Process View Data Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip ...

Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...

Compared with traditional spherical bumps, cylindrical CPBs have higher aspect ratio and can solve the ultra-fine pitch problem of high-density package. At the same time, the CPBs also have excellent ...

Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip version ; UMC 40nm LP LowK Logic Process Data Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for Solder bump Flip chip ...

The best time to put your money in a savings account is when interest rates are increasing. A bump-up CD can help you take advantage of such an environment and maximize your yields. A bump-up CD ...

Advanced IC packaging is transforming the semiconductor industry, driving performance and efficiency amid the global chip ...

The beginner-friendly FixHub Smart Soldering Iron and Portable Power Station is USB-C-powered and reaches soldering temperature in under five seconds. By Josh Hendrickson Updated September 12, 2024 ...

STM32 Based soldering station for JBC cartridges, 9-24 VDC and USB-PD power ...

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