Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...

ASE Technology remains the OSAT market leader, with advanced packaging capabilities driving potential growth. Read why we ...

According to the Yole Group, the advanced IC substrate market is expected to have a CAGR of 9% up to 2029 reaching a ...

The advanced IC substrate market is expected to have a CAGR 24-29 of 9% to  $25.53 billion in 2029, according to Yole Group.

Electronics Engineering Herald is an online magazine for electronic engineers with focus on hardware design, embedded, VLSI, and design tools. EE Herald publishes design ideas, technology trends, ...

10:39【兴森科技：FCBGA封装基板尚未有内资企业进入大批量量产阶段】兴森科技在互动平台表示，FCBGA封装基板尚未有内资企业进入大批量量产阶段。

兴森科技在互动平台表示，FCBGA封装基板尚未有内资企业进入大批量量产阶段。公司目前已具备20层及以下产品的量产能力，最小线宽线距达9/12um ...

IT之家 9 月 5 日消息，集邦咨询 Trendforce 今天（9 月 5 日）发布博文，伴随着参与者越来越多，倒装芯片球栅阵列封装（FCBGA）基板行业正在蓬勃发展。

IT之家 9 月 5 日消息，集邦咨询 Trendforce 今天（9 月 5 日）发布博文，伴随着参与者越来越多，倒装芯片球栅阵列封装（FCBGA）基板行业正在蓬勃发展。 FCBGA 简介 FCBGA（Flip Chip Ball Grid Array，意为“倒装芯片球栅阵列封装”）是一种封装技术，这种封装方式将芯片 ...

近日，三星电机表示，到2026年，其用于服务器和人工智能的高端倒装芯片球栅阵列 (FCBGA) 基板的销售份额将提高到50%以上。 FCBGA是一种集成电路封装技术，全称为“Flip Chip Ball Grid Array”，意为“倒装芯片球栅阵列封装”，这种封装方式将芯片倒置并连接到封装 ...

We are recognized for our industry-leading semiconductor substrate such as BGA and FCBGA technology through 'Supplier of the Year – Components Award' said Duckhyun Chang, CEO of Samsung ...