网页5 天之前 · Feature. Wire Bonding. Flip Chip. General Description. Wire Bonding is a long-standing and popular interconnection method, that uses thin metallic bond wires, typically made of gold, aluminum or copper, that are thermally or ultrasonically connected to chip terminals on one end, and the package pins or PCB on the other end.. Flip Chip, AKA Controlled Collapse Chip Connection (C4), is an ...